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T h i s m a t er i a l a n d t h e in f or m at i o n h e r ei n i s th e pr o pe r ty o f Fuji Electric D e v i c e Te c h n o lo g y C o . , L td . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ir d par t y n or u s e d f or t he m an uf ac tur ing p urp os e s w ith ou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
DATE
S P E C I F I C AT I O N
DWG.NO.
CHECKED FEB.-20-` 07 07 CHECKED FEB.-20-`
DRAWN FEB.-20-` 07
NAME
Spec. No.
Type Name
Device Name
APPROVED
MS5D3001
ESAD92-03R
SILICON DIODE
Fuji Electric Device Technology Co.,Ltd.
MS5D3001 1/12
H04-004-07b
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
Date
FEB.-20 -2007 Classification Enactment Ind. Content
Revised
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
Applied date Issued date Drawn Checked
Records
MS5D3001 2/12
Approved
H04-004-06b
1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE ESAD92-03R 2. OUT VIEW , MARKING , MOLDING RESIN , CHARACTERISTICS (1) Out view is shown (2) Marking is shown (3) Molding resin Epoxy resin UL:V-0 MS5D3001 10/1212/12 Indispensable description items are shown as below. (4) Characteristics is shown MS5D3001 MS5D3001 9/12 9/12
It is marked to type name or abbreviated type name, polarity and Lot No.
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
Bar Code Label of EIAJ C-3 Specification. (1) Type Name (2) Production Code (3) Quantity (4) Lot (Date code) (5) Company Code
3. RATINGS 3.1 MAXIMUM RATINGS ITEM Repetitive peak reverse voltage Average output current Non-repetitive forward surge current** Operating junction temperature Storage temperature
*
(at Ta=25
unless otherwise specified.) SYMBOL VRRM Io IFSM Tj Tstg Out put current of center tap full wave connection. Rating per element (at Ta=25 unless otherwise specified.) CONDITIONS IF = 10 A VR = VRRM IF=0.1A,IR=0.2A,Irec=0.05A Junction to case MAXIMUM 1.2 200 0.04 1.5 UNITS V A s /W 50Hz Square wave duty =1/2 Tc = 110 Sine wave, 10ms 1shot CONDITIONS RATINGS 300 20 * 80 150 -40150 UNITS V A A
**
3.2 ELECTRICAL CHARACTERISTICS ITEM Forward voltage *** Reverse current *** Reverse recovery time*** Thermal resistance
SYMBOL VF IR trr Rth(j-c) *** Rating per element
3.3 MECHANICAL CHARACTERISTICS Mounting torque Approximate mass Recommended torque 0.40.6 5.5 Nm g
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3001 3/12
H04-004-03a
4. TEST AND INSPECTION 4.1 STANDARD TEST CONDITION Standard test condition is Ta=2565%R.H. If judgment is no doubt, the test condition is possible to test in normal condition Ta=5354885%R.H. 4.2 STRUCTURE INSPECTION It inspect with eye and measure, Item 2 shall be satisfied. 4.3 FORWARD AND REVERSE CHARACTERISTICS It inspect on the standard condition, Item 3.2 shall be satisfied. 4.4 TEST
Reference Test No. 1
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
Test Items
Testing methods and Conditions
Standard EIAJ ED4701
Sampling number
Acceptance number
Terminal Strength (Tensile)
Pull force : 25N Force maintaining duration :101s
EIAJ ED4701/401 method 1
5
2
Terminal Strength (Bending)
Load force : 10N Number of times : 2times(90deg./time)
EIAJ ED4701/401 method 3 EIAJ ED4701/402 method 2 EIAJ ED4701/403 test code D
5
3
Mounting Strength
Screwing torque value:(M3) : 5010Ncm
5
4
Vibration
Frequency : 100Hz to 2kHz Acceleration : 100m/s
2
Sweeping time : 4min./1 cycle
Mechanical test
5
4times for each X, Y&Z directions. 5 Shock Peak amplitude : 15km/s Duration time : 0.5ms 3times for each X, Y&Z directions. 6 Solder ability 1 Solder : Sn-37Pb Solder temp. : 2355 Immersion time : 50.5s Apply to flux Solder ability 2 Solder : Sn-3Ag-0.5Cu Solder temp. : 2455 5 Immersion time : 50.5s Apply to flux 7 Resistance to Soldering Heat Solder temp. : 2605C Immersion time : 101s Number of times : 1times
EIAJ ED4701/302 test code A
2
EIAJ ED4701/404 test code D EIAJ ED4701/303 test code A
5
(0 : 1)
5
5
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3001 4/12
H04-004-03a
Test No. 1
Test Items High Temp. Storage
Reference Testing methods and Conditions Standard EIAJ ED4701 Temperature :stg max Test duration : 1000h Temperature :stg min Test duration : 1000h Temperature : 852C Relative humidity : 855% Test duration : 1000h Temperature : 852C Relative humidity : 855% Bias Voltage : VRRMx 0.8 Test duration : 1000h
EIAJ ED4701/103 test code C EIAJ ED4701/202 EIAJ ED4701/201
Sampling number
Acceptance number
22
2
Low Temp. Storage
22
3
Temperature Humidity Storage
EIAJ ED4701/103 test code C
22
4
Temperature Humidity Bias
22
5
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
Unsaturated Pressurized Vapor
Temperature : 1302C Relative humidity : 855% Vapor pressure : 230kPa Test duration : 48h
EIAJ ED4701/103 test code F
22
Endurance test
6
Temperature Cycle
High temp. side : Tstg max Room temp. : 535 Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles
EIAJ ED4701/105
(0 : 1) 22
7
Thermal Shock
Fluid : pure water(running water) High temp. side : 100+0/-5C Low temp. side : 0+5/-0C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles
EIAJ ED4701/307 test code A
22
8
Steady state Operating life
Ta=255C Rated load Test duration : 1000h Tj=Tjmax 50 3min ON, 3min OFF Test duration : 10000cycles Temperature : Ta=100 C Bias Voltage : VR=VRRM duty=1/2 Test duration : 1000h
EIAJ ED4701/101 EIAJ ED4701/106
22
9
Intermittent Operating life
22
10
High Temp. Reverse Bias
22
Failure Criteria
IR USL x 5 VFUSL x 1.1
USL : Upper specification Limit
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3001 5/12
H04-004-03a
5.Cautions Although Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. Computers OA equipment Measurement equipment Electrical home appliances Communications equipment (Terminal devices) Machine tools Personal equipment AV equipment Industrial robots etc.
The products described in this Specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are considering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning.
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
Transportation equipment (automobiles, trains, ships, etc.) Backbone network equipment Gas alarms, leakage gas auto breakers Nuclear control equipment etc. Do not use the products in this Specification for equipment requiring strict reliability such as (but not limited to): Aerospace equipment Aeronautical equipment 6.Warnings The Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc...). Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. You must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. Consider the possible temperature rise not only for the junction and case, but also for the outer leads. Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. The Diodes are made of incombustible material. However, if a Diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. The Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) The Diodes should not used in an irradiated field since they are not radiation proof. Traffic-signal control equipment Submarine repeater equipment
Burglar alarms, fire alarms, emergency equipment Medical equipment
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3001 6/12
H04-004-03a
Installation Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Solder Method Duration temperature Flow 2605 101sec Soldering iron 35010 3.50.5sec The immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. When flow-soldering, be careful to avoid immersing the package in the solder bath. Refer to the following torque reference When mounting the device on a heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance, both of which conditions may destroy the device.
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
Table 2:Recommended tightening torque Package style Screw Recommended tightening torque 0.40.6Nm The heat sink should have a flatness within 30m and roughness within 10m. Also, keep the tightening torque within the limits of this specification. Improper handling may cause isolation breakdown leading to a critical accident. We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. Storage The Diodes must be stored at a standard temperature of 5 to 35 and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. The Diodes should not be subjected to rapid changes in temperature to avoid condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. The Diodes should not be stored on top of each other, since this may cause excessive external force on the case. The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. The Diodes should be stored in antistatic containers or shipping bags. TO-3P M3
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3001 7/12
H04-004-03a
7.Appendix This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. This products does not contain Class-I ODS and Class-II ODS substances set force by `l nAr Ce ai A t f S law. co U '
If you have any questions about any part of this Specification, please contact Fuji Electric Device Technology or its sales agent before using the product Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. The application examples described in this specification are merely typical uses of Fuji Electric DeviceTechnology products. This specification does not confer any industrial property rights or other rights, nor constitute a
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
license for such rights.
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3001 8/12
H04-004-03a
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
Sn-Cu dipping(Pb1000ppm)
MS5D3001 9/12
H04-004-03a
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
WF
Forward Power Dissipation
(W)
IF Forward Current (A)
0.1 10 1
10 12 14 8
0
2
4
6
0.0
0
I0
0.2
2
0.4
360
Io
0.6 0.8 1.0
4
6
8
Forward Characteristic (typ.)
Forward Power Dissipation (max.)
Average Output Current
VF Forward Voltage (V)
1.2
Tj=150C
Square wave =120 Square wave =60 Sine wave =180
(A) DC
1.4 1.6
Per 1element Square wave =180
IR
10 10
10
Tj=125C
Tj=25C
12
DWG.NO.
0
Fuji Electric Device Technology Co.,Ltd.
Reverse Current (mA)
10 10
PR
-3
Reverse Power Dissipation
1.2 1.4 1.6 1.8 2.0 2.2 2.4
(W)
10
-2 -1 0 1
0.0
0.2
0.4
0.6
0.8
1.0
0
VR
100
360
Reverse Characteristic (typ.)
Reverse Power Dissipation (max.)
VR
100
200
VR Reverse Voltage (V)
Reverse Voltage
200
(V)
300
MS5D3001 10/12
DC
=180
Tj=150C
Tj= 25C
Tj=100C
Tj=75C
Tj=125C
300
400
H04-004-03a
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
S h M P a H l Wa eC r n () F e k a - v ur t A f e
Tc
100 110 120 130 140 150 160 50 60 70 80 90 0
Case Temperature
(C)
170
100
10
5
1
Io Sine wave =180 Square wave =180 Square wave =120 Square wave =60
10
Surge Capability (max.)
Current Derating (Io-Tc) (max.)
Io:Output current of center-tap full wave connection
:Conduction angle of forward current for each rectifier element
Number of Cycles at 50Hz
Average Output Current
15 20
DC
(A)
10
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
Cj Junction Capacitance (pF)
10 10
VR Reverse Voltage (V)
100
Junction Capacitance Characteristic (typ.)
MS5D3001 11/12
H04-004-03a
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
Transient Thermal Impedance
10 10
0 -1
(C/W)
10
-2
10
-1
t
DWG.NO.
10
0
Fuji Electric Device Technology Co.,Ltd.
Transient Thermal Impedance (max.)
Time (sec)
10
1
Rth j-c:1.5/W
10
2
MS5D3001 12/12
H04-004-03a

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